Grooves formed around a semiconductor device on a circuit board



FIG. 1 shows a plan view of the design according to a first embodiment of the invention.

FIG. 2 shows a bottom view of the design according to the invention. A claimed portion is not seen from the bottom.

FIG. 3 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 1.

FIG. 4 shows an enlarged sectional view along the line 4—4 in FIG. 3.

FIG. 5 shows an enlarged sectional view along the line 5—5 in FIG. 3.

FIG. 6 shows a perspective view of the design in FIG. 1, on which an semiconductor device (not claimed) is disposed.

FIG. 7 shows an enlarged sectional view along the line 5—5 in FIG. 3, on which a semiconductor device (not claimed) is disposed.

FIG. 8 shows a plan view of the design according to a second embodiment of the invention.

FIG. 9 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 8.

FIG. 10 shows an enlarged sectional view along the line 10—10 in FIG. 9; and,

FIG. 11 shows an enlarged sectional view along the line 11—11 in FIG. 9.

The elements shown in broken lines are for illustrative purpose only and form no part of the claimed invention. 

The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described. 